Associated Research HYAMP Series
- Ground Bond Testing with Compact Bench-top Design
- Entry Level Data Capabilities
- Perfect for Production Line Manufacturers
- Extended Warranty Available
Ground Bond Testing made easy. Verify the integrity of your product’s ground circuitry with the New HYAMP® Ground Bond Tester. Ground Bond Testing has never been more efficient with on-board data storage, convenient front panel USB data collection, and front panel barcode connection capabilities. We’ve included AC and DC current capabilities within one Ground Bond Tester to improve testing flexibility. Interconnect the HYAMP® Series with the Hypot® Series to form a complete safety compliance system. The HYAMP Series includes model 3240.