The HYAMP Series is an industry-leading ground bond test instrument that performs both AC and DC ground bond testing at currents up to 40A to verify electrical safety compliance in manufactured products. It features 4-wire measurement for precise milliohm readings, USB connectivity for easy data transfer, and a compact lightweight design that reduces footprint while maintaining full functionality. The HYAMP is ideal for production line testing and laboratory applications where manufacturers need reliable, data-driven ground bond verification with flexible test capabilities.
